The Packaging Startup Forum is an open call for the most disruptive startups from the packaging sector

The first Packaging Startup Forum, co-organized with La Salle Technova, will take place on February 13th, within the framework of Pick & Pack event. It is a boutique innovation event for industrial leaders and SMEs that seeks solutions in packaging and intralogistics, and will be held from February 12nd to 14th, 2020 in Barcelona.

The Packaging Startup Forum seeks the most innovative initiatives that propose new packaging solutions for the future of sectors such as food and beverages, retail, textile, non-food, cosmetics and beauty, chemistry and pharmacy, automotive, logistics services, electronics and goods industrial. The solutions may be focused on packaging design projects, ecopackaging, smart packaging, packaging and new materials, technologies for printing machinery, components or control systems, among others.

The forum complements a three-day agenda together with the National Packaging 4.0 Congress and the European Intralogistics Summit 2020. Pick & Pack will bring together more than 200 firms and more than 7,000 professionals in Barcelona who are looking for more efficient, innovative and sustainable solutions for their management area and industry.

Startups have until January 22nd, 2020 to be selected and to present their pitch to investors and industrial leaders, and will be evaluated by a committee of experts regarding the ability to solve the challenges of the sector, the use of disruptive technologies, the sustainability of the project or the impact on the economy and society.

Those selected will present their project at the Packaging Startup Forum, in addition they will be automatically selected as candidates for the 2020 Smart Logistics & Packaging Awards.

The needs and challenges of this industry have been increased with the development of connectivity and digital transformation, which has favored the emergence of new forms of business and emerging technology-based companies that are providing innovative ideas to solve these new challenges. Don’t miss this opportunity! Apply here.